METHOD AND APPARATUS FOR PREDICTING TEMPERATURE OF HEAT SINK, AND METHOD FOR MEASURING JUNCTION TEMPERATURE OF POWER MODULE USING THEREOF

A method for predicting a temperature of a heat sink for cooling a power module including at least one switching element and a Negative Temperature Coefficient of Resistance (NTC) sensor is provided. The method for predicting a temperature of a heat sink includes: estimating a temperature variation...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, JeHwan, KOH, Yeongju, LEE, Seong Min, SHIN, Sangcheol
Format:	Patent
Sprache:	eng
Schlagworte:	MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A method for predicting a temperature of a heat sink for cooling a power module including at least one switching element and a Negative Temperature Coefficient of Resistance (NTC) sensor is provided. The method for predicting a temperature of a heat sink includes: estimating a temperature variation of the NTC sensor using a power loss of the power module based on a power loss occurring in the at least one switching element according to driving of the power module and a thermal resistance of the power module; obtaining a temperature of the power module detected by the NTC sensor; and predicting the temperature of the heat sink from a difference between the temperature of the power module and the temperature variation of the NTC sensor.