DEPOSITION APPARATUS

A deposition apparatus including a support unit that supports a second surface of a substrate having a first surface and the second surface opposed to the first surface, and a chuck having a first pattern portion and a second pattern portion that are adjacent to each other, and receive different vol...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HAN, GYEONGHEE, LEE, SANGKEUN, SUNG, BYUNGHUN
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition apparatus including a support unit that supports a second surface of a substrate having a first surface and the second surface opposed to the first surface, and a chuck having a first pattern portion and a second pattern portion that are adjacent to each other, and receive different voltages, respectively. The substrate has a first part overlapping the first pattern portion of the chuck and a second part overlapping the second pattern portion of the chuck, and the support unit has a first support unit and a second support unit that support different portions of the second part.