INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

An integrated circuit device including a first semiconductor chip, a plurality of signal through silicon vias (TSV), a second semiconductor chip, a plurality of signal bumps and an interposer may be provided. The signal TSVs may be in the first semiconductor chip by a first pitch. The second semiconductor chip may be on the first semiconductor chip. The signal bumps may be on a lower surface of the second semiconductor chip by a second pitch wider than the first pitch. The interposer may be interposed between the first semiconductor chip and the second semiconductor chip and may be electrically connecting the signal TSVs with the signal bumps. Thus, an occupying area of the signal TSVs in the first semiconductor chip may be decreased so that the integrated circuit device may have a smaller size.