DEPOSITION APPARATUS

A deposition apparatus includes: a vaporization portion to vaporize a first material, a second material, and a third material different from each other; and a first nozzle portion connected adjacent to the vaporization portion. The first nozzle portion includes: a first nozzle hole to discharge the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HAN, JONGBUN, HAN, INAE, SEO, DONGKIUN, PARK, Gan Young, PARK, SUNGJONG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A deposition apparatus includes: a vaporization portion to vaporize a first material, a second material, and a third material different from each other; and a first nozzle portion connected adjacent to the vaporization portion. The first nozzle portion includes: a first nozzle hole to discharge the first material; a second nozzle hole adjacent to the first nozzle hole and to discharge the second material; and a third nozzle hole adjacent to the first nozzle hole and the second nozzle hole and to discharge the third material.