SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

A semiconductor package includes semiconductor structures stacked in a stepwise manner. Each of the semiconductor structures may include a lower structure, an upper structure on the lower structure, and an insulating layer provided on a bottom surface of the upper structure to be in contact with at...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LEE, JUNGPIL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes semiconductor structures stacked in a stepwise manner. Each of the semiconductor structures may include a lower structure, an upper structure on the lower structure, and an insulating layer provided on a bottom surface of the upper structure to be in contact with at least a portion of side surfaces of the lower structure. An area of the lower structure may be smaller than an area of the upper structure, when viewed in a plan view, and a side surface of the insulating layer may be vertically aligned to a side surface of the upper structure.