SECURITY WIRE OVER STITCH BOND

An electronic device includes a package structure, a conductive terminal exposed outside the package structure, a semiconductor die in the package structure, and a bond wire having contiguous first and second portions. The first portion has a first end and a second end, the first end connected to th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Rabilas, JR., Aniceto, De Asis, Ray Fredric, Colte, Jason
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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