SECURITY WIRE OVER STITCH BOND

An electronic device includes a package structure, a conductive terminal exposed outside the package structure, a semiconductor die in the package structure, and a bond wire having contiguous first and second portions. The first portion has a first end and a second end, the first end connected to th...

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Bibliographische Detailangaben
Hauptverfasser:	Rabilas, JR., Aniceto, De Asis, Ray Fredric, Colte, Jason
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An electronic device includes a package structure, a conductive terminal exposed outside the package structure, a semiconductor die in the package structure, and a bond wire having contiguous first and second portions. The first portion has a first end and a second end, the first end connected to the semiconductor die by a first bond and the second end connected to the conductive terminal by a second bond. The second portion has a first end and a second end, the first end of the second portion connected to the second end of the first portion, and the second end of the second portion connected to the conductive terminal by a third bond.