ELECTRONIC MODULE AND ELECTRONIC APPARATUS

An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configure...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG, Jung Jui, LEE, Pao-Nan, LEE, Chang Chi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configured to transmit a power from outside of the electronic module to the electronic component. The second region is configured to dissipate heat from the electronic component.