HEAT REDUCTION ASSOCIATED WITH PROSTHESES
A method, including placing a transcutaneous power transfer apparatus at a location on a surface of the skin proximate an implanted medical device, transferring power from the apparatus to the implanted medical device, and actively cooling the transcutaneous power transfer apparatus below the ambien...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method, including placing a transcutaneous power transfer apparatus at a location on a surface of the skin proximate an implanted medical device, transferring power from the apparatus to the implanted medical device, and actively cooling the transcutaneous power transfer apparatus below the ambient temperature prior to and/or after commencing transfer of power from the apparatus to the implanted medical device. |
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