SEMICONDUCTOR PACKAGE

A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a transparent substrate on the semiconductor chip, a dam structure between the semiconductor chip and the transparent substrate, a dummy pad on a lower side of the dam structure and to which no wirin...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHO, Kyong Soon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!