SEMICONDUCTOR PACKAGE
A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a transparent substrate on the semiconductor chip, a dam structure between the semiconductor chip and the transparent substrate, a dummy pad on a lower side of the dam structure and to which no wirin...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a transparent substrate on the semiconductor chip, a dam structure between the semiconductor chip and the transparent substrate, a dummy pad on a lower side of the dam structure and to which no wiring is connected, a planarization film extending along an upper surface of the semiconductor chip and a passivation film on the planarization film, wherein the planarization film is spaced apart from the dam structure. |
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