SUBSTRATE TREATING METHOD, SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING LIQUID

A substrate treating method according to the present invention is a substrate treating method for treating a pattern-formed surface of a substrate W, the substrate treating method including: a supply process of supplying a substrate treating liquid containing a sublimable substance and a solvent to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KUNIEDA, Shogo, SASAKI, Yuta, HANAWA, Yosuke
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	A substrate treating method according to the present invention is a substrate treating method for treating a pattern-formed surface of a substrate W, the substrate treating method including: a supply process of supplying a substrate treating liquid containing a sublimable substance and a solvent to the pattern-formed surface; a solidification process of evaporating the solvent in a liquid film of the substrate treating liquid supplied to the pattern-formed surface in the supply process, depositing the sublimable substance, and forming a solidified film containing the sublimable substance; and a sublimation process of sublimating the solidified film and removing the solidified film, in which the sublimable substance contains at least one of 2,5-dimethyl-2,5-hexanediol and 3-trifluoromethylbenzoic acid.