PLASMA HYPERMODEL INTEGRATED WITH FEATURE-SCALE PROFILE MODEL FOR ACCELERATED ETCH PROCESS DEVELOPMENT

Plasma parameters at a surface of a wafer are determined with a plasma hypermodel based on plasma processing conditions. A post-processing profile can be predicted for the surface of the wafer with a feature-scale profile model. Correlations in the plasma hypermodel can be recalibrated if the post-p...

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Hauptverfasser: PANNEERCHELVAM, Premkumar, HUANG, Shuo, HUARD, Chad, SMITH, Mark D
Format: Patent
Sprache:eng
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Zusammenfassung:Plasma parameters at a surface of a wafer are determined with a plasma hypermodel based on plasma processing conditions. A post-processing profile can be predicted for the surface of the wafer with a feature-scale profile model. Correlations in the plasma hypermodel can be recalibrated if the post-processing profile is outside a convergence criterion of an experimental reference.