COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. The apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the se...

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Bibliographische Detailangaben
Hauptverfasser:	RADKE, ROBERT EDWARD, HELBERG, CHRISTOPHER M, JAGGERS, CHRISTOPHER M
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED HEATING AND REFRIGERATION SYSTEMS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PHYSICS PRINTED CIRCUITS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING WEAPONS
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Beschreibung
Zusammenfassung:	An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. The apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the second heat transfer element. Each of the plurality of thermally conductive paths are configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element.