SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS

In some examples, a semiconductor package includes a semiconductor die; a conductive member coupled to the semiconductor die; and a multi-layer package substrate. The multi-layer package substrate includes a first horizontal metal layer to provide a ground connection; a second horizontal metal layer above the first horizontal metal layer; vertical members coupling to the first and second horizontal metal layers; and a mold compound covering the first and second horizontal metal layers and the vertical members. The first horizontal metal layer, the second horizontal metal layer, and the vertical members together form a structure including a conductive strip coupled to the conductive member, a transition member coupled to the conductive strip, a waveguide coupled to the transition member, and a horn antenna coupled to the waveguide.