WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING A SEMICONDUCTOR CIRCUIT

WAFER COMPOSITE, SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING A SEMICONDUCTOR CIRCUIT

A layer stack is formed that includes a device layer and an insulator layer. The device layer includes electronic elements. The insulator layer is adjacent to a back surface of the device layer. A spacer disk is adhesive bonded on the layer stack on a side opposite the device layer. The spacer disk...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Busch, Jörg, Porwol, Danie, Schmidt, Matthias, Debie, Derek, Fischer, Thomas, Gruber, Hermann
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A layer stack is formed that includes a device layer and an insulator layer. The device layer includes electronic elements. The insulator layer is adjacent to a back surface of the device layer. A spacer disk is adhesive bonded on the layer stack on a side opposite the device layer. The spacer disk and the layer stack form a wafer composite. The wafer composite is divided into a plurality of individual semiconductor chips. Each semiconductor chip includes a portion of the layer stack and a portion of the spacer disk.