COMPONENT COOLER WITH MULTIPLE FLUID PATHS

COMPONENT COOLER WITH MULTIPLE FLUID PATHS

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: RADKE, ROBERT EDWARD, HELBERG, CHRISTOPHER M, JAGGERS, CHRISTOPHER M
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
REGULATING
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Beschreibung
Zusammenfassung:An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component and a second heat transfer element configured to be thermally coupled to the heat-generating component. A manifold is configured to receive a single fluid flow of a heat transfer medium and split the single fluid flow into a first split fluid flow provided to the first heat transfer element and a second split fluid flow provided to the second heat transfer element.