Selective Deposition of Thin Films with Improved Stability

A method of processing a substrate is disclosed which includes depositing a layer in a processing chamber on a field region, a sidewall region, and a fill region of a feature of the substrate, wherein a hardness of a portion of the layer deposited on the sidewall region is lower than a hardness of a...

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Bibliographische Detailangaben
Hauptverfasser: XIONG, Lulu, WANG, Zongbin, SEUTTER, Sean M, SEE, Guan Huei, LO, Chieh-Wen, SUO, Peng, RAMASAMY, Balamurugan, LIU, Chris, Hsiao, Kevin, ZENG, Shengwei, PADHI, Deenesh, LIANTO, Prayudi
Format: Patent
Sprache:eng
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Zusammenfassung:A method of processing a substrate is disclosed which includes depositing a layer in a processing chamber on a field region, a sidewall region, and a fill region of a feature of the substrate, wherein a hardness of a portion of the layer deposited on the sidewall region is lower than a hardness of a portion of the layer deposited on the field region, and lower than a hardness of a portion of the layer deposited on the fill region.