PHOTODIODE MODULES WITH REDUCED RECOVERY TIMES

PHOTODIODE MODULES WITH REDUCED RECOVERY TIMES

In some examples, a photodiode module may include a photodiode chip, a submount located adjacent to the photodiode chip, and a heating element to heat the photodiode chip. By increasing the temperature of the photodiode chip through use of the heating element, the cutoff wavelength of the photodiode...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VERDUN, Michael, JACQUY, Pierrick
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In some examples, a photodiode module may include a photodiode chip, a submount located adjacent to the photodiode chip, and a heating element to heat the photodiode chip. By increasing the temperature of the photodiode chip through use of the heating element, the cutoff wavelength of the photodiode chip may be increased, which may also increase the quantum efficiency and the recovery time of the photodiode chip.