PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS

PACKAGED FLIP CHIP RADIO FREQUENCY TRANSISTOR AMPLIFIER CIRCUITS

RF transistor amplifier circuits are provided that comprise a circuit board and an RF transistor amplifier die. The RF transistor amplifier die is flip-chip mounted on an upper surface of the circuit board so that a gate terminal, a drain terminal and a source terminal of the die face the upper surf...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Komposch, Alexander, Fisher, Jeremy, Wah, Woo Eng, Lee, Liew Soon, Pun, Arthur Fong-Yuen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:RF transistor amplifier circuits are provided that comprise a circuit board and an RF transistor amplifier die. The RF transistor amplifier die is flip-chip mounted on an upper surface of the circuit board so that a gate terminal, a drain terminal and a source terminal of the die face the upper surface of the circuit board. These RF transistor amplifier circuits further include a heatsink mounted on an upper surface of the RF transistor amplifier die and a plurality of surface mount circuit elements mounted on the upper surface of the circuit board so that a footprint of the heatsink vertically overlaps each of the plurality of surface mount circuit elements.