ELECTROLYTIC SURFACE FINISH ARCHITECTURE

Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a se...

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Bibliographische Detailangaben
Hauptverfasser: CHEN, Haobo, AHMED, Numair, TANAKA, Hiroki, NIE, Bai, MCELHINNY, Kyle, DARMAWIKARTA, Kristof, PIETAMBARAM, Srinivas V, CHO, Steve S, GAMBA, Jason M, HARIRI, Haifa, GUO, Xiaoying, LEHAF, Ali
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments disclosed herein include package substrates and methods of forming package substrates. In an embodiment, the package substrate comprises a core, and a pad over the core, where the pad has a first width. In an embodiment, a surface finish is over the pad, where the surface finish has a second width that is substantially equal to the first width. In an embodiment, the package substrate further comprises a solder resist over the pad, where the solder resist comprises an opening that exposes a portion of the surface finish. In an embodiment, the opening has a third width that is smaller than the second width.