INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

An integrated package and a method for making the same are provided. The integrated package includes: a first substrate including: a first interconnection area having a plurality of first interconnection structures; and a first alignment structure disposed outside the first interconnection area; a second substrate stacked above the first substrate and including: a second interconnection area having a plurality of second interconnection structures; and a second alignment structure disposed outside the second interconnection area, wherein the second alignment structure is substantially aligned with the first alignment structure in a stacking direction of the first substrate and the second substrate; and a connecting element disposed between the first substrate and the second substrate and configured for electrically connecting at least one of the plurality of first interconnection structures with at least one of the plurality of second interconnection structures.