METHOD FOR MAKING AN ELECTRONIC PACKAGE

METHOD FOR MAKING AN ELECTRONIC PACKAGE

An electronic package and a method for making an electronic package are provided. The electronic package comprises a substrate; a plurality of electronic components disposed on the substrate; and an encapsulant cap for encapsulating the substrate and the plurality of electronic components, wherein t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SONG, SangHo, TAK, HyunSu, SHIN, DongChul
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package and a method for making an electronic package are provided. The electronic package comprises a substrate; a plurality of electronic components disposed on the substrate; and an encapsulant cap for encapsulating the substrate and the plurality of electronic components, wherein the encapsulant cap comprises a top surface having a first region and a second region; and wherein the first region has a first roughness, the second region has a second roughness greater than the first roughness.