METHOD FOR ANALYZING DEFECTS OF A STRUCTURED COMPONENT

An analysis of the defects of a structured component includes a check of a local deviation between an actual structure dimension of the component and a target structure dimension of the component. In this context, the local deviation is checked at a location of a test path along a deviation coordina...

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Bibliographische Detailangaben
Hauptverfasser:	Tusch, Jan, Zeuner, Thomas, Dornbusch, Kay
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	An analysis of the defects of a structured component includes a check of a local deviation between an actual structure dimension of the component and a target structure dimension of the component. In this context, the local deviation is checked at a location of a test path along a deviation coordinate which extends across the test path. The test is repeated at a plurality of different test path locations within a test region of the test path. A summed local deviation between the actual structure dimension and the target structure dimension over the test region is determined. The local deviation is compared with a local deviation tolerance value. The summed local deviation is compared with a summation deviation tolerance value. This results in a defect analysis with enhanced significance, which is implementable using a metrology system in particular.