SEMICONDUCTOR DEVICE AND INVERTER UNIT

A semiconductor chip (2,3) is mounted on the heat spreader (1). A frame (4) is bonded to an upper surface of the semiconductor chip (2,3). Mold resin (9) seals the heat spreader (1), the semiconductor chip (2,3) and the frame (4) and has a recess (10) provided on an upper surface of the mold resin (...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AIKO, Mitsunori, KIMOTO, Nobuyoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!