SEMICONDUCTOR DEVICE AND INVERTER UNIT

A semiconductor chip (2,3) is mounted on the heat spreader (1). A frame (4) is bonded to an upper surface of the semiconductor chip (2,3). Mold resin (9) seals the heat spreader (1), the semiconductor chip (2,3) and the frame (4) and has a recess (10) provided on an upper surface of the mold resin (...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AIKO, Mitsunori, KIMOTO, Nobuyoshi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor chip (2,3) is mounted on the heat spreader (1). A frame (4) is bonded to an upper surface of the semiconductor chip (2,3). Mold resin (9) seals the heat spreader (1), the semiconductor chip (2,3) and the frame (4) and has a recess (10) provided on an upper surface of the mold resin (9). A heat dissipation plate (12) is externally attached to the recess (10) via a thermally conductive material (11) having thermal conductivity higher than that of the mold resin (9). The heat dissipation plate (12) is insulated from the semiconductor chip (2,3) and the frame (4) by the mold resin (9). The heat dissipation plate (12) is a flat plate having an upper surface and a lower surface which are opposite to each other and flat.