SEMICONDUCTOR DEVICE AND INVERTER UNIT

SEMICONDUCTOR DEVICE AND INVERTER UNIT

A semiconductor chip (2,3) is mounted on the heat spreader (1). A frame (4) is bonded to an upper surface of the semiconductor chip (2,3). Mold resin (9) seals the heat spreader (1), the semiconductor chip (2,3) and the frame (4) and has a recess (10) provided on an upper surface of the mold resin (...

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Hauptverfasser: AIKO, Mitsunori, KIMOTO, Nobuyoshi
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator AIKO, Mitsunori
KIMOTO, Nobuyoshi
description A semiconductor chip (2,3) is mounted on the heat spreader (1). A frame (4) is bonded to an upper surface of the semiconductor chip (2,3). Mold resin (9) seals the heat spreader (1), the semiconductor chip (2,3) and the frame (4) and has a recess (10) provided on an upper surface of the mold resin (9). A heat dissipation plate (12) is externally attached to the recess (10) via a thermally conductive material (11) having thermal conductivity higher than that of the mold resin (9). The heat dissipation plate (12) is insulated from the semiconductor chip (2,3) and the frame (4) by the mold resin (9). The heat dissipation plate (12) is a flat plate having an upper surface and a lower surface which are opposite to each other and flat.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR DEVICE AND INVERTER UNIT
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