COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY

An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to...

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Bibliographische Detailangaben
Hauptverfasser: GENG, Phil, MIELE, Ralph V, AHUJA, Sandeep, SPRENGER, Mark E, TAN, Guixiang, SAHA, Sanjoy K, SHIA, David, CHUANG, Jimmy, SMALLEY, Jeffory L
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus is described. The apparatus includes a semiconductor chip package, a main cooling mass, a heat pipe and a remote cooling mass. The apparatus further includes: a) a channel in one of the main and remote cooling masses into which the heat pipe is inserted, the channel being wide enough to allow movement of the heat pipe within the channel in response to relative movement of the main and remote cooling masses, wherein, the main cooling mass comprises a chamber with liquid, the heat pipe comprises a fluidic channel that is coupled to the chamber and vapor from the liquid is to be condensed within the heat pipe; b) a flexible region integrated into the heat pipe; and/or, c) a flexible connector into which the heat pipe is inserted.