INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Provided is an integrated dicing die bonding sheet having excellent storage stability and stress relaxation properties, having no problems such as chip flying, chipping, cracking, and the like during a dicing process, and having excellent production efficiency; and a method of manufacturing a semico...

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Bibliographische Detailangaben
Hauptverfasser:	SUTOH, Manabu, TODA, Nohno, KITAURA, Eiji
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MICROSTRUCTURAL TECHNOLOGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is an integrated dicing die bonding sheet having excellent storage stability and stress relaxation properties, having no problems such as chip flying, chipping, cracking, and the like during a dicing process, and having excellent production efficiency; and a method of manufacturing a semiconductor device (particularly including a MEMS device) using the same. An integrated dicing die bonding sheet including a base film, and a silicone-based adhesive sheet having an adhesive surface adhered to the semiconductor wafer, wherein at a stage after dicing the semiconductor wafer and prior to heating, the base film can be interfacially peeled from the silicone-based adhesive sheet, and after the adhesive surface is heated within a range of 50 to 200° C., a peeling mode of the adhesive surface from another non-pressure-sensitive adhesive base material changes to cohesive failure, exhibiting permanent adhesion.