ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

An electronic component includes a plurality of base materials laminated in a thickness direction, interlayer connection conductor provided in base materials and filled in a through hole penetrating in the thickness direction, and internal electrode formed at a position where internal electrode over...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OIE, Hirofumi, OTSUBO, Yoshihito
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An electronic component includes a plurality of base materials laminated in a thickness direction, interlayer connection conductor provided in base materials and filled in a through hole penetrating in the thickness direction, and internal electrode formed at a position where internal electrode overlaps interlayer connection conductor when viewed from the thickness direction, internal electrode being formed with base material interposed between internal electrode and interlayer connection conductor. Interlayer connection conductor has a cavity. Cavity being formed so as to be shifted internal electrode side in the thickness direction of the through hole.