THERMALLY CONDUCTIVE SILICONE COMPOSITION

A thermally conductive silicone composition including: (A) an organopolysiloxane represented by the following general formula (1) having a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) an organopolysiloxane other than the component (A), represented by the following general formula (2) and...

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA, Kunihiro, AKIBA, Shota, TSUJI, Kenichi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A thermally conductive silicone composition including: (A) an organopolysiloxane represented by the following general formula (1) having a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) an organopolysiloxane other than the component (A), represented by the following general formula (2) and having a kinematic viscosity at 25° C. of 1,000 to 100,000 mm2/s, (C) an organosilane represented by the following general formula (3), and (D) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or more. A thermally conductive silicone composition which does not cause a thickening phenomenon during preservation and has excellent shift resistance is provided.R3cSiO(4-c)/2 (2)R4dR5eSi(OR6)4-d-e (3)