UV-CURABLE TAPE

A curable composition comprising 20 wt. % to 60 wt. %, optionally 30 wt. % to 58 wt. %, or optionally 40 wt. % to 55 wt. % of an acrylic block copolymer, 5 wt. % to 60 wt. %, optionally 20 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of an epoxy resin; 1 wt. % to 60 wt. %, optionally 5 wt....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Janoski, Jonathan E, Schafer, Kathleen S, Satrijo, Andrew, Moughton, Adam O
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A curable composition comprising 20 wt. % to 60 wt. %, optionally 30 wt. % to 58 wt. %, or optionally 40 wt. % to 55 wt. % of an acrylic block copolymer, 5 wt. % to 60 wt. %, optionally 20 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of an epoxy resin; 1 wt. % to 60 wt. %, optionally 5 wt. % to 50 wt. %, or optionally 15 wt. % to 45 wt. %, of a polyol; and 0.5 wt. % to 10 wt. %, optionally 0.75 wt. % to 8 wt. %, or optionally 1 wt. % to 5 wt. %, of a curing agent. The curable composition may be used to prepare a tape that is initially soft (i.e., low-modulus), which enables a water-tight seal during an electronics assembly process at ambient temperatures, and then cures after UV-activation into a more rigid (i.e., higher modulus) tape that has a desirable balance of impact resistance (both tensile and shear impact), dynamic shear resistance, and pushout resistance.