SOLVENT-FREE RESIN COMPOSITION AND USES OF THE SAME

A solvent-free resin composition and uses thereof are provided. The resin composition includes:(A) a maleic acid-modified liquid hydrocarbon resin;(B) a first filler having a D50 particle size of 1 μm to 4 μm; and(C) a second filler having a D50 particle size of 5 μm to 10 μm.The solvent-free resin...

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Bibliographische Detailangaben
Hauptverfasser:	LIU, Shur-Fen, TANG, Jui-Hsiang
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A solvent-free resin composition and uses thereof are provided. The resin composition includes:(A) a maleic acid-modified liquid hydrocarbon resin;(B) a first filler having a D50 particle size of 1 μm to 4 μm; and(C) a second filler having a D50 particle size of 5 μm to 10 μm.The solvent-free resin composition can be used to fill the holes of printed circuit boards.