MICROELECTROMECHANICAL SYSTEMS PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A microelectromechanical systems (MEMS) package includes a first MEMS package and a second MEMS package laterally spaced apart from the first MEMS package. The first MEMS package includes a first device substrate including a first MEMS device, a first cap substrate bonded to the first device substra...

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Bibliographische Detailangaben
Hauptverfasser:	CHAND, RAKESH, YELEHANKA, RAMACHANDRAMURTHY PRADEEP, ZHOU, GUOFU, Soo, Sock Kuan, Yap, Poh Liang
Format:	Patent
Sprache:	eng
Schlagworte:	GYROSCOPIC INSTRUMENTS INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY NAVIGATION PERFORMING OPERATIONS PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SURVEYING TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A microelectromechanical systems (MEMS) package includes a first MEMS package and a second MEMS package laterally spaced apart from the first MEMS package. The first MEMS package includes a first device substrate including a first MEMS device, a first cap substrate bonded to the first device substrate, where the first cap substrate encloses a first cavity and a vent hole connected to the first cavity. A first sealing layer is filled in the vent hole, where the first sealing layer is disposed between the first device substrate and the first cap substrate. The second MEMS package includes a second device substrate including a second MEMS device and a second cap substrate. The second cap substrate is bonded to the second device substrate and encloses a second cavity. The first cavity has a first pressure, and the second cavity have a second pressure different from the first pressure.