PROCESS FOR MANUFACTURING WEARABLE RING FORM FACTOR

PROCESS FOR MANUFACTURING WEARABLE RING FORM FACTOR

Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mäkinen, Jukka-Tapani, Haverinen, Teemu Juhani, Lämsä, Antti, Latomäki, Mikko, Uusitalo, Marko
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BRACELETS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COINS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HABERDASHERY
HUMAN NECESSITIES
JEWELLERY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
OTHER PERSONAL ADORNMENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material.