SEMICONDUCTOR MODULE

A semiconductor module according to an embodiment includes a first conductor, a second conductor, a third conductor, a fourth conductor, a plurality of conductive bonding materials, and a plurality of multi-gate semiconductor devices. The multi-gate semiconductor device includes a semiconductor laye...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKANO, Tatsunori, ADACHI, Kento, INOKUCHI, Tomoaki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor module according to an embodiment includes a first conductor, a second conductor, a third conductor, a fourth conductor, a plurality of conductive bonding materials, and a plurality of multi-gate semiconductor devices. The multi-gate semiconductor device includes a semiconductor layer, a collector electrode. The multi-gate semiconductor device includes an emitter electrode, a first gate electrode, and a second gate electrode bonded to the second to fourth conductors via conductive bonding materials.