SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

A semiconductor package includes; a package substrate, a first chip mounted on the package substrate, a support frame pattern surrounding the first chip and defining a trench between the first chip and the support frame pattern, an adhesive film at least partially filling the trench, second semicond...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: JUNG, HWANWOOK
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes; a package substrate, a first chip mounted on the package substrate, a support frame pattern surrounding the first chip and defining a trench between the first chip and the support frame pattern, an adhesive film at least partially filling the trench, second semiconductor chips stacked on the support frame pattern, bonding wires connecting chip pads associated with the semiconductor chips with the substrate pads, and a sealing member covering the second semiconductor chips.