CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

This document discloses techniques, apparatuses, and systems for connecting semiconductor dies through traces. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first dielectric layer at which first circuitry is disposed. The second se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zhou, Wei, McDaniel, Terrence B, Street, Bret K, Kirby, Kyle K, Raman, Thiagarajan, Song, Jaekyu, Griffin, Amy R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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