CONNECTING SEMICONDUCTOR DIES THROUGH TRACES

This document discloses techniques, apparatuses, and systems for connecting semiconductor dies through traces. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die includes a first dielectric layer at which first circuitry is disposed. The second semiconductor die includes a second dielectric layer at which second circuitry is disposed. One or more traces extend from a side surface of the first dielectric layer and at a side surface of the second dielectric layer to electrically couple the first circuitry and the second circuitry. In doing so, rigid connective structures may not be needed to couple the first semiconductor die and the second semiconductor die.