POST PASSIVATION INTERCONNECT

POST PASSIVATION INTERCONNECT

An integrated circuit (IC) device includes a redistribution line over a substrate, wherein a first angle between a topmost surface of the redistribution line and a sidewall of the redistribution line is within a first angle range, a second angle between a bottommost surface of the redistribution lin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIH, Yu-Lung, CHANG, C. C, KUO, Alan, LIN, Yi-An
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit (IC) device includes a redistribution line over a substrate, wherein a first angle between a topmost surface of the redistribution line and a sidewall of the redistribution line is within a first angle range, a second angle between a bottommost surface of the redistribution line and the sidewall of the redistribution line is within a second angle range, and the second angle range is different from the first angle range. The IC device further includes a passivation layer over the redistribution line, wherein a bottommost surface of the passivation layer is below the bottommost surface of the redistribution line.