SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus includes a nozzle, a pipe, a protective pipe, a nozzle driver, and a leak sensor. The nozzle discharges a processing liquid to a substrate to be processed. The pipe is connected to the nozzle. The protective pipe surrounds an outer periphery of the pipe. The nozzle d...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KOMORI, Jun
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A substrate processing apparatus includes a nozzle, a pipe, a protective pipe, a nozzle driver, and a leak sensor. The nozzle discharges a processing liquid to a substrate to be processed. The pipe is connected to the nozzle. The protective pipe surrounds an outer periphery of the pipe. The nozzle driver moves the nozzle. The leak sensor detects a leak liquid from the pipe.