POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTED THROUGH A DEVICE SUBSTRATE

A power amplifier device includes first and second power transistor dies and a substrate. Each die includes an elongated bondpad and an integrated transistor with a terminal that is coupled to the elongated bondpad. The substrate is formed from a stack of multiple dielectric layers and multiple patterned conductive layers in an alternating arrangement, and a plurality of conductive vias electrically coupling portions of the conductive layers. The substrate includes elongated first and second die contacts exposed at a first substrate surface and connected to the first and second elongated bondpads, respectively. The substrate also includes a conductive structure connected between the first and second die contacts. The conductive structure is formed from portions of the patterned conductive layers and at least two vias of the plurality of conductive vias.