SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

A semiconductor package includes a redistribution wiring layer having redistribution wirings stacked in at least two levels; a first semiconductor chip arranged on the redistribution wiring layer; a plurality of second semiconductor chips arranged on the first semiconductor chip; first conductive wires electrically connecting first chip pads of the first semiconductor chip and the redistribution wirings of the redistribution wiring layer; second conductive wires electrically connecting second chip pads of the plurality of second semiconductor chips and the redistribution wirings of the redistribution wiring layer; and a sealing unit disposed on the redistribution wiring layer.