SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

Apparatus and methods are disclosed, including stacked die devices and systems. Example stacked die devices and methods include an array of interconnect pillars that includes more than one pillar height. Example stacked die devices and methods include an array of interconnect pillars that includes a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kawakita, Keizo, Hsu, Bang-Ning, Yamaguchi, Hidenori
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Apparatus and methods are disclosed, including stacked die devices and systems. Example stacked die devices and methods include an array of interconnect pillars that includes more than one pillar height. Example stacked die devices and methods include an array of interconnect pillars that includes a pillar height distribution mapped to a known warpage profile.