SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor devices and semiconductor device assemblies, and related systems and methods, are disclosed herein. In some embodiments, the semiconductor device includes a support substrate, a first die package carried by the support substrate, and a second die package carried by the first die package. Each of the first and second die packages can include a first die, a second die hybrid bonded a surface of the first die, and a third die hybrid bonded to a surface of the second die. The first die is coupled to the third die via an interconnect portion of the second die. Further, the third die can include an array of active cells for each of the packages, the second die can include complementary-metal-oxide-semiconductor (CMOS) circuitry accessing the active cells, and the first die can include backend of line (BEOL) circuitry associated with the active cells and CMOS circuitry.