SEMICONDUCTOR PACKAGE

A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are pos...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, Hyung Jun, KIM, Kwang-Bae, PARK, So Yoen, CHAE, Jin Won, JUNG, Moon Gil
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor package includes a redistribution substrate having a first side and an opposite second side. A plurality of redistribution patterns are in the redistribution substrate, and a semiconductor chip is on the first side of the redistribution substrate. A plurality of metal pillars are positioned around and spaced apart from a periphery of the semiconductor chip and are connected to the redistribution patterns. A plurality of solder balls are on the second side of the redistribution substrate. Each of the metal pillars includes a third side facing the first side of the redistribution substrate, and an opposite fourth side. The fourth side has a square or octagonal shape in plan view.