Two-In-One Lead Frame Package
A lead frame package includes a first semiconductor chip, a second semiconductor chip, and a first lead frame. The first semiconductor chip is connected to a die attachment pad using a first clip. The second semiconductor chip is connected to the die attachment pad using a second clip. The die attac...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A lead frame package includes a first semiconductor chip, a second semiconductor chip, and a first lead frame. The first semiconductor chip is connected to a die attachment pad using a first clip. The second semiconductor chip is connected to the die attachment pad using a second clip. The die attachment pad is sandwiched between the first semiconductor chip and the second semiconductor chip. The first lead frame is connected to the die attachment pad. |
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