ACTIVE AREA SALICIDATION FOR NMOS AND PMOS DEVICES

A variety of applications can include apparatus having p-channel metal-oxide-semiconductor (PMOS) transistors and n-channel metal-oxide-semiconductor (NMOS) transistors with different metal silicide contacts. The active area of the NMOS transistor can include a first metal silicide having a first metal element, where the first metal silicide is a vertical lowest portion of a contact for the NMOS. The PMOS transistor can include a stressor source/drain region to a channel region of the PMOS transistor and a second metal silicide directly contacting the stressor source/drain region without containing the first metal element. The process flow to form the PMOS and NMOS transistors can enable making simultaneous contacts by a pre-silicide in the active area of the NMOS transistor, without affecting stressor source/drain regions in the PMOS transistor. The process flow and resulting structures for PMOS transistors and NMOS transistors can be used in various integrated circuits and devices.