IN-CHAMBER METROLOGY OF SUBSTRATES FOR PROCESS CHARACTERIZATION AND IMPROVEMENT

IN-CHAMBER METROLOGY OF SUBSTRATES FOR PROCESS CHARACTERIZATION AND IMPROVEMENT

A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the substrate pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Roy, Tapashree, Gupta, Nitin, Egan, Todd, Bavigadda, Viswanath
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the substrate processing system. The method further includes processing the first data to obtain second data. The second data includes a first indication of performance of the substrate processing system. The method further includes causing, in view of the second data, performance of a corrective actions associated with the substrate processing system.