RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

A resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being co...

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Bibliographische Detailangaben
Hauptverfasser: HONG, Suk Koo, KIM, Kyungoh, KIM, Jaemyoung, KOH, Moo Hyun
Format: Patent
Sprache:eng
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Zusammenfassung:A resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being combinable with the central metal via a coordination bond.